Electronic device, electronic apparatus, moving object, and method for manufacturing electronic device

ABSTRACT

An electronic device includes: an electronic component including an external connection terminal; and a lead frame (metal member) connected to the external connection terminal. The lead frame is disposed with a pad. The pad overlaps the external connection terminal in plan view, and at least a portion of the pad is located outside the external shape of the electronic component in plan view. The pad and the external connection terminal are connected by means of a conductive bonding member. The pad and the electronic component are bonded together with a resin. The resin extends to a region of the pad located outside the external shape of the electronic component in plan view.

BACKGROUND

1. Technical Field

The present invention relates to an electronic device, an electronicapparatus, a moving object, and a method for manufacturing an electronicdevice.

2. Related Art

As an example of piezoelectric oscillators including a piezoelectricresonator, there is a crystal oscillator including a quartz crystalresonator. As typical configurations for obtaining frequency stabilityagainst the temperature of the quartz crystal oscillator, a temperaturecompensated crystal oscillator (TCXO) and an oven controlled crystaloscillator (OCXO) have been known. The TCXO is configured such that atemperature compensated circuit using a thermosensor is incorporated tocorrect an oscillating frequency based on the temperature detected valueof the thermosensor. The TCXO has advantages in that it has low powerconsumption, and is generally small in size and light in weight,compared to the OCXO described later. However, the TCXO is susceptibleto an ambient temperature compared to the OCXO, and therefore, it isdifficult to apply the TCXO when high frequency-stability is required.

On the other hand, the OCXO has a structure in which a quartz crystalresonator is at a constant temperature by heating with a heating elementsuch as, for example, a heater to maintain the constant ambienttemperature of the quartz crystal resonator. However, the OCXO needs astructure to reduce the power consumption of the heater by preventingthe heat of the quartz crystal resonator from escaping to the outside.

Japanese Patent No. 4804813 (Patent Document 1) discloses aconfiguration in which a quartz crystal resonator to which a resistanceheating element and a thermosensor are attached is connected to a boardvia a lead frame to thereby be supported by the lead frame in a statewhere the quartz crystal resonator floats above the board.JP-A-2010-199678 (Patent Document 2) discloses the followingconfiguration. An electrode of a quartz crystal resonator accommodatedin a package is connected to a through-electrode formed in the package,and a lead frame is connected to a portion of the package where thethrough-electrode is exposed. The package is connected to a board viathe lead frame, so that the package is supported in a state of floatingabove the board. With the configuration disclosed in Patent Document 1,it is possible to reduce the conduction of heat of the quartz crystalresonator to the board side. With the configuration disclosed in PatentDocument 2, it is possible to reduce the conduction of heat of thepackage including the quartz crystal resonator to the board side.

In the related art, however, in the connection between the electrode ofthe quartz crystal resonator and the lead frame and in the connectionbetween the electrode on the board and the lead frame, the bonding areaof the lead frame is the width of the lead frame itself at most.Therefore, the connection strength may be insufficient. For increasingthe connection strength between the quartz crystal resonator and thelead frame, there is a method of disposing a castellation in the quartzcrystal resonator to form a fillet at a connecting portion between thequartz crystal resonator and the lead frame. This method can increasethe connection strength between the quartz crystal resonator and thelead frame, but the strength of the quartz crystal resonator itself maybe lowered because a recess is disposed in the quartz crystal resonator,that is, the package by disposing the castellation.

SUMMARY

An advantage of some aspects of the invention is to provide anelectronic device capable of increasing the bonding strength between anelectronic component and a metal member without lowering the mechanicalstrength of the electronic component, an electronic apparatus and amoving object both using the electronic device, and a method formanufacturing an electronic device.

The invention can be implemented as the following forms or applicationexamples.

APPLICATION EXAMPLE 1

This application example is directed to an electronic device including:an electronic component including an external connection terminal; and ametal member connected to the external connection terminal, wherein themetal member is disposed with a pad, the pad overlapping the externalconnection terminal in plan view, at least a portion of the pad beinglocated outside the external shape of the electronic component in planview, the pad and the external connection terminal are connected bymeans of a conductive bonding member, and the pad and the electroniccomponent are bonded together with a resin, the resin extending to aregion of the pad located outside the external shape of the electroniccomponent in plan view.

The resin in the form of a liquid before curing is introduced bycapillary action into a gap between the electronic component (externalconnection terminal) and the pad. With the configuration describedabove, therefore, the portion of the pad protruding from the externalshape of the electronic component in plan view can be used as a guidefor introducing the resin into the gap between the external connectionterminal and the pad, so that the resin can be easily introduced intothe gap in the electronic device.

Moreover, the resin reinforces the connection between the electroniccomponent and the pad, and the resin is present around the conductivebonding member. Since the resin is located outside a region where thepad and the electronic component overlap each other, the bonding area ofthe resin to the pad can be increased. Hence, the mechanical connectionbetween the electronic component and the pad can be furtherstrengthened, so that the bonding of the electronic component with themetal member can be realized with high reliability in the electronicdevice.

APPLICATION EXAMPLE 2

This application example is directed to the electronic device accordingto Application Example 1, wherein the pad covers the external connectionterminal in plan view.

With the configuration described above, the area of bonding between theexternal connection terminal and the pad by means of the conductivebonding member is assured while keeping the strong mechanical connectionbetween the electronic component and the pad, so that the electricalconnection between the external connection terminal and the pad can befurther strengthened.

APPLICATION EXAMPLE 3 AND APPLICATION EXAMPLE 4

These application examples are directed to the electronic deviceaccording to Application Examples 1 and 2, respectively, wherein theresin covers at least a portion of a side surface of the electroniccomponent.

With the configuration described above, the bonding area of the resin tothe pad and the bonding area of the resin to the electronic componentcan be increased to further strengthen the mechanical connection betweenthe electronic component and the pad.

APPLICATION EXAMPLE 5, APPLICATION EXAMPLE 6, AND APPLICATION EXAMPLE 7

These application examples are directed to the electronic devicesaccording to Application Examples 1 to 3, respectively, wherein theresin is a thermosetting resin.

With the configuration described above, the electronic component and thepad can be easily bonded together with the resin.

APPLICATION EXAMPLE 8

This application example is directed to an electronic apparatusincluding the electronic device according to Application Example 1.

With the configuration described above, the bonding of the electroniccomponent with the metal member is realized with high strength in theelectronic apparatus.

APPLICATION EXAMPLE 9

This application example is directed to a moving object including theelectronic device according to Application Example 1.

With the configuration described above, the bonding of the electroniccomponent with the metal member is realized with high strength in themoving object.

APPLICATION EXAMPLE 10

This application example is directed to a method for manufacturing anelectronic device in which a metal member is connected to an externalconnection terminal of an electronic component, the method including:forming a pad at the metal member; connecting the pad and the externalconnection terminal by means of a conductive bonding member such thatthe pad and the external connection terminal overlap each other in planview, and that at least a portion of the pad is located outside theexternal shape of the electronic component in plan view; and bonding thepad and the electronic component together with a resin and extending theresin to a region of the pad located outside the external shape of theelectronic component in plan view.

The resin in the form of a liquid before curing is introduced bycapillary action into a gap between the electronic component (externalconnection terminal) and the pad. With the configuration describedabove, therefore, the portion of the pad protruding from the externalshape of the electronic component in plan view can be used as a guidefor flowing the resin into the gap between the external connectionterminal and the pad, so that the resin can be easily introduced intothe gap.

Moreover, the resin reinforces the connection between the electroniccomponent and the pad, and the resin is present around the conductivebonding member. Since the resin is located outside a region where thepad and the electronic component overlap each other, the bonding area ofthe resin to the pad can be increased. Hence, the mechanical connectionbetween the electronic component and the pad can be furtherstrengthened, so that the bonding of the electronic component with themetal member can be realized with high reliability.

APPLICATION EXAMPLE 11

This application example is directed to the method for manufacturing theelectronic device according to Application Example 10, furtherincluding, after the extending of the resin, bending the metal member ata position overlapping an external shape line of the resin in plan view.

With the method described above, the metal member can be easily bentwithout applying a mechanical load to the conductive bonding member.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will be described with reference to the accompanyingdrawings, wherein like numbers reference like elements.

FIG. 1 is a side view of an electronic device of a first embodiment.

FIG. 2 is a plan view of the electronic device of the first embodiment.

FIG. 3 is a bottom plan view of the electronic device of the firstembodiment.

FIG. 4 shows a manufacturing step (before soldering) of the electronicdevice of the first embodiment.

FIG. 5 shows a manufacturing step (introduction of a resin) of theelectronic device of the first embodiment.

FIG. 6 shows a manufacturing step (after thermal curing) of theelectronic device of the first embodiment.

FIG. 7 shows a manufacturing step (attachment of a heater and the like)of the electronic device of the first embodiment.

FIG. 8 shows a manufacturing step (arrangement between dies) of theelectronic device of the first embodiment.

FIG. 9 shows a manufacturing step (bending of a lead frame) of theelectronic device of the first embodiment.

FIG. 10 is a side view of an electronic device of a second embodiment.

FIG. 11 is a plan view of the electronic device of the secondembodiment.

FIG. 12 shows a manufacturing step (arrangement between dies) of theelectronic device of the second embodiment.

FIG. 13 shows a manufacturing step (bending of a lead frame) of theelectronic device of the second embodiment.

FIG. 14 is a schematic view of an electronic apparatus in which theelectronic device of the embodiment is mounted.

FIG. 15 is a schematic view of a moving object in which the electronicdevice of the embodiment is mounted.

DESCRIPTION OF EXEMPLARY EMBODIMENTS

Hereinafter, the invention will be described in detail using embodimentsshown in the drawings. However, constituent elements, kinds,combinations, shapes, relative arrangements thereof, and the likedescribed in the embodiments are not intended to limit the scope of theinvention but are merely explanatory examples unless a specificdescription is provided.

First Embodiment

FIG. 1 shows a side view of an electronic device of a first embodiment.FIG. 2 shows a plan view of the electronic device of the firstembodiment. FIG. 3 shows a bottom plan view of the electronic device ofthe first embodiment. FIG. 3 shows the electronic device by seeingthrough a board 34. As shown in FIG. 1, the electronic device 10 of theembodiment is mounted on the board 34 as a mounting destination andcomposed mainly of an electronic component 12 and lead frames 22 as anexample of metal members attached to the electronic component 12.

Features of First Embodiment

The electronic device 10 of the embodiment has the following features. Apad 26 is disposed at an end of the lead frame 22. The pad 26 and anexternal connection terminal 20 are connected by means of a conductivebonding member 30. The pad 26 overlaps the external connection terminal20 in plan view. A portion of the external shape of the pad 26 islocated outside the external shape of the electronic component 12. Thepad 26 and the external connection terminal 20 are bonded together witha resin 32. The resin 32 extends, in plan view, outside a region wherethe pad 26 and the electronic component 12 overlap each other.

The resin 32 in the form of a liquid before curing is introduced bycapillary action into a gap between the electronic component 12 (theexternal connection terminal 20) and the pad 26. With the configurationdescribed above, therefore, the portion of the pad 26 protruding fromthe external shape of the electronic component 12 in plan view can beused as a guide for introducing the resin 32 into the gap between theexternal connection terminal 20 and the pad 26, so that the resin 32 canbe easily introduced into the gap.

Moreover, the resin 32 reinforces the connection between the electroniccomponent 12 and the pad 26, and the resin 32 is present around theconductive bonding member 30. Since the resin 32 is located outside theregion where the pad 26 and the electronic component 12 overlap eachother, the bonding area of the resin 32 to the pad 26 can be increased.Hence, the mechanical connection between the electronic component 12 andthe pad 26 can be further strengthened, so that the bonding of theelectronic component 12 with the lead frame 22 can be realized with highreliability.

Electronic Component

The external shape of the electronic component 12 is formed of a package14. For example, a resonator element (not shown) is accommodated in thepackage 14. As the resonator element, it is possible to apply a tuningfork-type piezoelectric resonator element, a double tuning fork-typepiezoelectric resonator element, an AT-cut resonator element, a doubleT-type gyro sensor, or the like whose main body is quartz crystal. It isalso possible to apply a tuning fork-type resonator element or the likewhose main body is silicon or the like and that has a piezoelectricmaterial arranged on the surface of the main body. The embodiment isdescribed on the assumption that the electronic component 12 is the OCXOdescribed above. However, the TCXO described above, a gyro sensor, orthe like can also be applied. A heater 16 and a thermistor 18 (FIGS. 2and 3) for OCXO are attached to an upper surface of the electroniccomponent 12. Also, the external connection terminals 20 electricallyconnected to the resonator element (not shown), the heater 16, and thethermistor 18 are disposed on the upper surface of the electroniccomponent 12. As many external connection terminals 20 (four in theembodiment) as the number of electrodes that are needed for the elementsto be mounted, such as the resonator element (not shown), the heater 16,and the thermistor 18, are disposed.

Lead Frame

The lead frame 22 is a conductive member having a shape bending in theheight direction. The lead frame 22 is composed of an elongated leadportion 24 and the pad 26 that is connected to an end of the leadportion 24 on the external connection terminal 20 side and wider thanthe lead portion 24. The pad 26 is arranged such that the external shapethereof includes therein the external shape of the external connectionterminal 20 of the electronic component 12 in plan view, and that aportion of the external shape of the pad 26 protrudes from the externalshape of the electronic component 12 in plan view.

The lead frame 22 is bent into a mountain shape at a boundary betweenthe pad 26 and the lead portion 24 of the lead frame 22 and bent into avalley shape in the vicinity of the tip of the lead portion 24. The tipportion of the lead portion 24 is connected to a mounting electrode 36on the board 34, and the pad 26 is connected to the external connectionterminal 20 of the electronic component 12. In the embodiment, achevron-shaped form is provided in the height direction of the board 34with the lead frame 22 located on the left side of FIG. 1 and the leadframe 22 located on the right side thereof. With this configuration, theelectronic component 12 is suspended by the lead frames 22 and floatsabove the board 34. Since the mountain shape and the valley shapedescribed above are formed in a shape in which a given curvature ismaintained, a concentration of stress on the mountain-shaped portion andthe valley-shaped portion is avoided.

For the material of the lead frame 22, a material having conductivityand a low thermal conductivity, such as 42 alloy or Kovar for example,is preferable when the electronic component 12 is an OCXO. With thismaterial, it is possible to reduce the dissipation of heat that issupplied from the heater 16 to the electronic component 12 (the insideresonator element) through the lead frame 22. Of course, a material (forexample, copper) other than the materials described above can also beused. Moreover, the width of the lead portion 24 is preferablysufficiently smaller than the width of the pad 26. For example, when thepad 26 is formed to have a width of from 1 to 2 mm, the width of thelead portion 24 is preferably from about 0.3 to 0.6 mm.

Conductive Bonding Member and Resin

The tip portion of the lead portion 24 and the mounting electrode 36 arebonded together with a conductive bonding member 28 (for example,solder). Similarly, the pad 26 and the external connection terminal 20are bonded together with the conductive bonding member 30 (for example,solder). Further, the gap formed due to the conductive bonding member 30between the electronic component 12 and the pad 26 is sealed by theresin 32, and the resin 32 is present around the conductive bondingmember 30. In FIG. 1 and the like, the external connection terminal 20and the conductive bonding member 30 are illustrated to be exposed fromthe resin 32 in order to facilitate visibility.

Before curing, the resin 32 enters the gap between the pad 26 and theelectronic component 12 by capillary action. On the other hand asdescribed above, the pad 26 is arranged such that a portion thereofprotrudes from the external shape of the electronic component 12 in planview. Therefore, the protruding portion serves as a guide forintroducing the resin 32 into the gap, so that the resin 32 can beeasily introduced. Moreover, the resin 32 extends, not only to the gap,but also to a position of the pad 26 overlapping the edge portion of theexternal shape of the electronic component 12 in plan view (FIGS. 2 and3). The extending portion of the resin forms a fillet 32 a having acurved surface shape as shown in FIG. 1. The surface of the fillet 32 ais a concave curved surface. With this configuration, the bonding areaof the resin 32 to the pad 26 can be increased to further strengthen themechanical connection between the electronic component 12 and the pad26. The fillet 32 a is also formed on the facing edge sides of the pads26 that are different from each other.

When a low melting point solder is used for the conductive bondingmember 30, the solder melts in some cases in a reflow step (a step ofconnecting the electronic device 10 to the board 34, a step of arrangingthe electronic device in an electronic apparatus (a highly functionalmobile phone 100 or the like described later), or the like). However,even when the solder melts, the bonding of the lead frame 22 with theexternal connection terminal 20 can be maintained by bonding the leadframe 22 and the external connection terminal 20 together with the resin32 around the solder. Moreover, for the resin 32, a thermosetting resinsuch as an epoxy-based resin is preferably used. For the thermosettingresin, a thermosetting resin having a curing temperature lower than themelting point of the conductive bonding member 30 is preferably used.

Manufacturing Steps

FIGS. 4 to 9 show manufacturing steps of the electronic device of thefirst embodiment. As shown in FIG. 4, the electronic component 12 andthe lead frames 22 before bending are formed, and the conductive bondingmember 30 (solder) is applied to the pad 26 of the lead frame 22 using aprinting technique or the like. As shown in FIG. 5, the pad 26 and theexternal connection terminal 20 are connected by means of the conductivebonding member 30. Then, as shown in FIG. 5, the resin 32 is introducedinto the gap formed due to the conductive bonding member 30 between thepad 26 and the external connection terminal 20. In this case, even whenthe resin 32 is introduced toward the portion of the pad 26 protrudingfrom the external shape of the electronic component 12 in plan view, theresin 32 that has reached the gap is introduced into the gap bycapillary action.

As shown in FIG. 6, after introducing the resin 32 into all of the gapsbetween the pads 26 and the external connection terminals 20, the resin32 is heated and cured. As shown in FIG. 7, the heater 16 and thethermistor 18 (refer to FIG. 2) are attached to the upper surface of theelectronic component 12. With these steps, the electronic device 10before bending the lead frames 22 is formed.

Next, as shown in FIG. 8, the electronic device 10 is arranged between adie 38 and a die 40 respectively having mating surfaces conforming tothe bending shape of the lead frame 22, and the electronic device 10(the electronic component 12) is fixed on the die 40 side with pressingmembers 42. Then, as shown in FIG. 9, a force is applied in a directionin which the die 38 and the die 40 are mated with each other, whilepressing the electronic device 10 with the pressing members 42, todeform the lead frame 22. With this step, the electronic device 10 shownin FIGS. 1, 2, and 3 is formed. As shown in FIG. 9, the lead frame 22 isbent in the first embodiment so as to have an acute angle on the sidethereof where the resin 32 is applied. Although the lead frame 22 can bebent at the boundary between the pad 26 and the lead portion 24 as shownin FIG. 9, the lead frame 22 can also be bent at a portion overlappingan external shape line of the resin 32 (the fillet 32 a) in plan view.In this case, stress can be concentrated on the pad 26 at a positionfacing the boundary of the resin 32 (the fillet 32 a), so that the pad26 can be easily bent. In any of these cases, however, the lead frame 22can be easily bent without applying a mechanical load to the conductivebonding member 30.

Second Embodiment

FIG. 10 shows a side view of an electronic device of a secondembodiment. FIG. 11 shows a plan view of the electronic device of thesecond embodiment. In the embodiment, constituent elements common to thefirst embodiment are denoted by the same reference numerals and signs,and the description thereof is omitted except when necessary. The basicconfiguration of the electronic device 10 a of the second embodiment issimilar to that of the first embodiment, but the electronic component 12is connected to the upper surfaces of the pads 26. The resin 32 ispresent between the pad 26 and the external connection terminal 20 andaround the conductive bonding member 30. The resin 32 extends to aposition overlapping the edge portion of the external shape of theelectronic component 12 on the pad 26 in plan view, and covers at leasta portion of a side surface of the electronic component 12. Further, theresin 32 is formed so as to cover the side surface around a cornerportion of the electronic component 12 and a portion of the uppersurface thereof. With this configuration, the bonding area of the resin32 to the pad 26 and the bonding area of the resin 32 to the electroniccomponent 12 can be increased to further strengthen the mechanicalconnection between the electronic component 12 and the pad.

Manufacturing Steps

FIGS. 12 and 13 show manufacturing steps of the electronic device of thesecond embodiment. In the manufacturing steps of the electronic device10 a of the second embodiment, the connection between the electroniccomponent 12 and the lead frames 22, and the like are first performedsimilarly to FIGS. 4 to 7. However, the resin 32 is applied in anintegral manner not only between the electronic component 12 and the pad26 but also to the side surface around the corner portion of theelectronic component 12 and a portion of the upper surface thereof, andin this state, thermal curing is performed.

Then, as shown in FIG. 12, the electronic device is arranged between thedie 38 and the die 40 in the same manner as described above. As shown inFIG. 13, a force is applied in the direction in which the die 38 and thedie 40 are mated with each other to deform the lead frame 22, so thatthe electronic device 10 a is formed. However, the lead frame 22 is bentso as to have an obtuse angle on the side thereof where the resin 32 isapplied, which is opposite side from the first embodiment. Also in thiscase, although the lead frame 22 can be bent at the boundary between thepad 26 and the lead portion 24, the lead frame 22 can be bent at aportion overlapping the external shape line of the resin 32 in planview, similarly to the first embodiment. Even with this way of bending,the lead frame 22 can be easily bent without applying a mechanical loadto the conductive bonding member 30.

In any of the embodiments, a multistage electronic device can beconstructed by further stacking the same type of electronic device asthe electronic device 10 or 10 a of the embodiment on the electroniccomponent 12. The embodiments have been described in which the pad 26 isarranged such that the external shape thereof includes therein theexternal shape of the external connection terminal 20 in plan view.However, the external connection terminal 20 may be arranged such that aportion of the external shape thereof protrudes from the external shapeof the pad 26 in plan view. Further, the embodiments have been describedin which the lead frame 22 is used as an example of a metal member.However, the metal member is not limited to the lead frame 22, and maybe configured using a rod-like member, a plate-like member, a memberobtained by combining a rod-like structure with a plate-like structure,or the like.

Electronic Apparatus and Moving Object

FIG. 14 is a schematic view of an electronic apparatus (highlyfunctional mobile phone) in which the electronic device of theembodiment is mounted. FIG. 15 is a schematic view of a moving object(automobile) in which the electronic device of the embodiment ismounted. As shown in FIG. 14, for example, an angular velocity sensor(not shown) that detects the attitude of the highly functional mobilephone 100 is incorporated in the highly functional mobile phone 100. Asa clock source for operating a control mechanism of the angular velocitysensor, the electronic device 10 or 10 a of the embodiment can be used.In addition, the electronic device 10 or 10 a of the embodiment can beused as a clock source of an electronic apparatus such as a digitalstill camera, a mobile phone, a portable game console, a gamecontroller, a car navigation system, a pointing device, a head-mounteddisplay, or a tablet personal computer. As shown in FIG. 15, anautomobile 200 includes, for example, a control mechanism (not shown)for stabilizing the attitude of the automobile body. As a clock sourcefor operating the control mechanism, the electronic device 10 or 10 a ofthe embodiment can be used.

The entire disclosure of Japanese Patent Application Nos: 2013-65758,filed Mar. 27, 2013 and 2013-71660, filed Mar. 29, 2013 are expresslyincorporated by reference herein.

What is claimed is:
 1. An electronic device comprising: an electroniccomponent including an external connection terminal; and a metal memberconnected to the external connection terminal, wherein the metal memberhas an elongated lead portion having a connecting portion, and a pad,the connecting portion connecting the elongated lead portion to the padand being bent, the pad having a longer width than the elongated leadportion in a direction perpendicular to an elongated direction, the padoverlapping the external connection terminal in plan view, at least aportion of the pad being located outside an external shape of theelectronic component in plan view, the pad and the external connectionterminal are connected by means of a conductive bonding member, the padand the electronic component are bonded together with a resin, the resinextends only i) to a region of the pad located outside the externalshape of the electronic component in plan view, ii) to a region betweena bottom surface of the pad and a top surface of the electroniccomponent or between a top surface of the pad and a bottom surface ofthe electronic component, iii) to the sides of the electronic componentextending from an edge of the top or bottom surface thereof, and iv)along an external shape of the pad that overlaps the electroniccomponent in plan view, and the pad covers an entirety of the externalconnection terminal in plan view.
 2. The electronic device according toclaim 1, wherein the resin covers at least a portion of a side surfaceof the electronic component.
 3. The electronic device according to claim1, wherein the resin is a thermosetting resin.
 4. The electronic deviceaccording to claim 2, wherein the resin is a thermosetting resin.
 5. Anelectronic apparatus comprising the electronic device according to claim1 mounted therein.
 6. A moving object comprising the electronic deviceaccording to claim 1 mounted therein.
 7. The electronic device accordingto claim 1, wherein the metal member is a lead frame.
 8. An oscillatorcomprising the electronic device according to claim 1 wherein theelectronic component includes a vibrating reed.
 9. The electronic deviceaccording to claim 1, wherein the pad has a rectangular shape in planview.
 10. The electronic device according to claim 1, wherein the resinis disposed between a lower surface of the pad and an upper surface ofthe external connection terminal such that the resins surrounds anentirety of the conductive bonding member in plan view.